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News

Tuesday, October 31, 2006

10:10 pm | Memory Corsair Puts Innovative Heat-Sinks onto Performance-Mainstream Modules. Corsair Installs Dual-Path Heat Exchange “Dominator” Coolers on PC2-6400

2:12 pm | CPU AMD Slashes Opteron Pricing. AMD’s Opteron Chips Become More Affordable

12:58 pm | Multimedia Consumer Electronic Companies Get Rid of Wires with WirelessHD. Leading Consumer Electronics Companies Co-Develop WirelessHD

11:25 am | Video Rydermark Set to Challenge 3DMark. New Software Suite for Testing Graphics Cards Coming

9:05 am | CPU AMD Touts “Fusion” Platforms – CPU/GPU Silicon to Become Available in 2008. AMD Discloses Details of CPU/GPU Designs

7:56 am | Coolers IBM Demos Next-Gen Cooling Technologies. IBM Proposes Direct Water Cooling for Chips

4:45 am | CPU AMD’s x86 Microprocessor Market Share Continues to Soar. AMD, Intel Solidify Positions, Change Roles

 
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