Bookmark and Share

Tags

32nm 40nm 45nm AMD Apple ASUS ATI ATIC Atom Business Cypress E-Book Evergreen Fermi Flash Geforce Globalfoundries GT300 Intel Microsoft Nintendo Nokia Nvidia Radeon Semiconductor Sony SSD TSMC USB Windows

News

While it is still unclear when Advanced Micro Devices releases its next-generation multi-processor server chips, Intel Corp. is gearing up to introduce its latest micro-architecture to MP server market in September, sources familiar with Intel’s plans revealed. The move will increase pressure on AMD’s product lineup.

The new Intel Xeon MP lineup will consist of eight microprocessors based on Intel’s latest Core 2 micro-architecture: six Tigerton QC chips and two Tigerton DC processors with four and two processing engines, respectively. The new chips will use 1066MHz quad-pumped bus and will also lower power consumption of Intel Xeon MP chips to the range between 50W and 130W. The products are set for September introduction, some sources indicated.

Five out of eight processors – models X7350 (quad-core, 2.93GHz), L7345 (quad-core, 1.86GHz), L7340 (quad-core, 2.40GHz), L7220 (dual-core, 2.13GHz) and L7210 (dual-core, 2.40GHz) – will have 8MB of cache, two – models L7320 (quad-core, 2.13GHz) and L7310 (quad-core, 1.60GHz) – will have 4MB of cache and one processor – L7330 (quad-core, 2.40GHz) – will have 6MB of cache.

The new Xeon MP processors will be priced from $856 to $2301.

In the multi-processor server space the transition for the new micro-architecture will be complicated by co-transition to a new platform code-named Caneland. Nevertheless, after accounting for about 13% of Intel Xeon MP shipments in Q3 2007, the share code-named Tigerton processors will grow to 80% of Intel’s MP chip supplies in Q1 2008.

Intel did not comment on the news-story.

Discussion

Comments currently: 0

You must log in to add comments.

Forgot password? Registration

remember me



Related news

Latest News

Friday, November 20, 2009

10:11 pm | ATI Seeks Its Best to Ensure More Radeon HD 5-Series Supplies – Company. Additional Number of DirectX 11 Graphics Boards is Incoming

11:56 am | Fusion-io’s SSD Setup Reaches 1TB/s Aggregate Bandwidth. Fusion-io Gets Contracts from Government, Creates World’s Fastest SSD Setup

10:06 am | Notebook – the Most Desired Christmas Gift, Says CEA. Notebooks, Players and HDTVs Top Christmas Presents Wish List

9:11 am | Ebay Completes Skype Sell Off. Skype No Longer Belongs to Ebay

Thursday, November 19, 2009

11:38 pm | Sony: PlayStation 3 – Firmware Upgradeable for Stereoscopic 3D. Sony to Upgrade Existing PlayStation 3 Consoles to Stereo 3D Capability

10:31 pm | Elpida Completes Development of 1Gb GDDR5 Chip, Mass Production Scheduled on Q2 2010. Elpida’s First 1Gb GDDR5 Chips to Work at 6GHz

7:32 pm | Galaxy Technology to Release Graphics Card to Rival Asus Mars – Rumour. Galaxy’s New “Masterpeace” is Dual-GPU GeForce GTX 285

2:39 pm | IBM and Infineon Want to Transform Altis into Contract Maker of Semiconductors. Altis Set to Become Independent Foundry Services Provider

12:24 pm | Intel to Explore Hyper Computers in New Research Center. Intel Creates European Exascale Computing Research Center to Study Exaflop Super Computers

9:18 am | Lenovo Readies World’s First AMD-Based ThinkPad Computer. Lenovo ThinkPad X100e: AMD Athlon Neo, DirectX 10, 11.6” HD Display