News Archive

April, 2007
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News

Monday, April 30, 2007

Corsair Ships “World’s Toughest” USB Flash Drives.

[12:20 pm]

Corsair’s Survivor Hits the Market

Sunday, April 29, 2007

Hynix Challenges Samsung as the World’s Top Memory Maker.

[11:55 pm]

Samsung, Qimonda Tumble, Hynix Lead Forward

Thursday, April 26, 2007

OCZ Unveils Mainstream-Speed Memory Modules for Extreme Overclockers.

[11:11 pm]

OCZ Brings Back “Enhanced Bandwidth” Technology

Buffalo Unveils DDR3 Memory Modules.

[2:09 pm]

Buffalo Set to Sell 2GB DDR3 Memory Kits for $1180

Wednesday, April 25, 2007

Memory Prices Set to Hit the Bottom in the Second Half of the Year.

[10:17 pm]

Prices of Memory Chips Set to Fall

Monday, April 23, 2007

SAMSUNG Electronics Develops New Stacking Process for DRAM.

[12:23 pm]

Memory packages will be faster, smaller and consume less power

Thursday, April 19, 2007

Qimonda and Advantest Develop Test Hardware for GDDR5.

[5:25 am]

Qimonda Readies Itself for GDDR5

Wednesday, April 11, 2007

Spansion and Qimonda Form Strategic Alliance.

[10:21 pm]

Spansion and Qimonda to Create DRAM-Flash Packages

Wednesday, April 4, 2007

OCZ Applies Passive Cooler to 1.15GHz Memory Modules.

[10:17 pm]

OCZ Releases New Memory Products with Reaper Cooler

Tuesday, April 3, 2007

Nvidia Warns about 1.20GHz Memory Modules.

[11:48 pm]

EVGA, Nvidia Say 2.4V Voltage for DDR2 is Deadly