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Monday, April 28, 2008
Court Overturns Federal Trade Commission’s Ruling Against Rambus.
[11:52 pm]
FTC Will Have to Reconsider Evidences Against Rambus
IBM and Spansion Ink Patent Cross-Licensing Agreement.
[10:14 pm]
IBM and Spansion Share Intellectual Property
Thursday, April 24, 2008
European Commission Lifts Off Countervailing Duties from Hynix’s Memory.
[2:29 pm]
Countervailing Duties Removed from Hynix Semiconductor’s Products in EU
Elpida Memory and Qimonda Agree to Form Technology Partnership.
[6:00 am]
Elpida and Qimonda to Jointly Develop Next-Gen Process Technologies
Wednesday, April 23, 2008
Spansion Inks Agreement with Rambus to Develop Next-Gen Flash Memory Solutions.
[10:50 pm]
Rambus and Spansion Sign Memorandum of Understanding
Super Talent Begins Shipments of “World’s First” High-Density Ultimate Speed Memory Kit.
[6:10 am]
Super Talent Unwraps 4GB DDR3 Memory Kit with 1800MHz Clock-Speed
Tuesday, April 22, 2008
Micron and Nanya Aim to Create Memory Joint-Venture.
[5:36 am]
Micron and Nanya Sign Agreement to Create Memory Joint-Venture
Thursday, April 17, 2008
OCZ Technology Speeds Up High-Speed Liquid-Cooling Memory.
[5:57 pm]
OCZ Unveils Another Set of Liquid-Cooler Memory Modules
Monday, April 14, 2008
IBM Invents Memory that Combines Capacity of Hard Drives with Portability of Flash.
[11:33 am]
IBM Details “Racetrack” Memory
Wednesday, April 9, 2008
Super Talent Unveils “World’s Tiniest” 8GB Flash Drive.
[3:58 pm]
Super Talent’s 8GB Flash Drive Fits on Finger Tip
Wednesday, April 2, 2008
Micron to Install 8GB DDR3 Memory Into Laptops.
[11:09 pm]
Micron Announced 4GB DDR3 Memory Modules
Tuesday, April 1, 2008
Rambus Proclaims Another XDR Shipments Milestone as Sony PlayStation 3 Gets More Popular.
[11:53 pm]
50 Million Rambus XDR Memory Chips Shipped, PS3 Still the Major XDR Consumer
Intel Validates DDR3 for Mobile Applications Ahead of Intel Centrino 2 Launch.
[10:49 pm]
Intel Gets Ready for Centrino 2 Platforms with DDR3 Validation
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