News

Shuttle has unveiled its new series of small PC barebones powered by Intel’s latest chips in LGA775 packaging. To feed the chips with enough power and provide sufficient cooling, the company that is mostly known for small form-factor barebones had to install more efficient power supply unit and develop a new design of chassis to provide better-organized air flows.

The manufacturer positions its XPC SB81P and XPC SB83G5 personal computer barebones for multimedia or workstation applications requiring a lot of computing power delivered by Intel’s latest microprocessors, such as Intel Pentium 4 560, along with the newest PCI Express x16 graphics cards, such as ATI RADEON X800 XT. The small form-factor (SFF) systems are equipped with 350W (SB81P) and 250W (SB83G5) power supply units and multiply fans in order to provide sufficient amount of power and cooling for modern high-performance components.

Earlier Shuttle offered barebones with either passive cooling, or with only one fan. However, it appears that even Shuttle’s high-performance heatsink based on heat-pipe technology cannot efficiently cool-down Intel’s new central processing units that can dissipate up to 115W nowadays, as a consequence, Shuttle had to install an active fan on its heatsink.

Shuttle’s new PC barebones are based on Intel’s 915G core-logic with ICH6R I/O controller, providing integrated DirectX 9.0 graphics core and high definition 7.1 audio along with multitude of other features. The systems are equipped with 2 DIMM slots for dual-channel PC3200 memory, 1 PCI Express x16 and 1 PCI slots for add-in cards, 4 Serial ATA-150 connectors for HDDs or optical drives and Gigabit Ethernet. Optionally end-users may install WLAN card into the systems.

Both barebones are expected to be available by mid-August for 379 (SB81P) and 275 (SB83G5) Euros excluding VAT.

Discussion

Comments currently: 1
Discussion started: 07/19/04 06:42:16 PM
Latest comment: 07/19/04 06:42:16 PM

[1-1]

1. 
"Earlier Shuttle offered barebones with either passive cooling, or with only one fan. However, it appears that even Shuttle’s high-performance heatsink based on heat-pipe technology cannot efficiently cool-down Intel’s new central processing units that can dissipate up to 115W nowadays, as a consequence, Shuttle had to install an active fan on its heatsink."

The SB83G5 uses the traditional ICE heatsink, which to my knowledge has been tested to 150W (it does however feature a larger 92mm fan). The SB81P on the other hand introduces a new heatsink design which is even more efficient and from the demonstartion I saw at computex, almost dead silent.

[Posted by: d_rogue  | Date: 07/19/04 06:42:16 PM]

[1-1]

You must log in to add comments.

Forgot password? Registration

remember me



Related news

Latest News

Friday, December 4, 2009

11:22 pm | Intel’s Next-Generation Platform to Support GPGPU. Intel’s Graphics Cores Set to Support Video Encoding

9:36 am | Foxconn Electronics Acquires PC Manufacturing Plant from Dell. Hon Hai Takes Over Dell’s Polish Plant

4:31 am | 82% of Young Americans Are Gamers – Report. American Kids Use Up to Three Gaming Devices

Thursday, December 3, 2009

11:32 pm | Startup Launches Gboard: Keypad for Gmail. Startup Releases Keypad with Gmail Shortcuts

8:00 pm | ATIC Will Continue to Invest into Globalfoundries Despite Dubai’s Debt Problems - Analyst. Analyst: Dubai's Debt Crisis Will Not Impact AMD, Globalfoundries

4:05 pm | Sony PSPgo May Receive External UMD Reader from Logitech - Rumour. Sony’s New PSP May Receive Support for Older UMB-Based Games

3:02 pm | Corsair Launches Dominator GTX 2.25GHz Memory Modules. Corsair Unveils World’s Fastest Memory Modules

11:06 am | Online Game Sales to Leave Sales of Packaged Games in 2010 Behind – CEO of Electronic Arts. Digital Video Game Sales to Surpass Sales of Packaged Games