News

Intel Corp. on Sunday updated its pricelist with minor changes in pricing of mobile microprocessors and Intel Centrino bundles. While the adjustments are insignificant, some large computer makers may benefit even from a several dollar price slash.

The decrease of pricing is not significant – Intel Centrino bundles that consist of an Intel Pentium M processor, an Intel mobile core-logic and an Intel PRO/Wireless WLAN controller dropped $2, or in the range of 0.28% - 0.74%. Intel reduced the costs for Intel Centrino sets with processor that use 533MHz processor system bus as well as on some of Low Voltage (LV) and Ultra Low Voltage (ULV) Intel Centrino bundles.

For instance, a package with Intel Pentium M 770 (2.13GHz), Intel 915 GM chipset and Intel PRO/Wireless 2915ABG controller now costs $703, down from $705. The most noteworthy price change was made to ULV Intel Celeron M processor 373 (1.0GHz): the chip now costs $144, down 10.56% from $161.

All of the processors with reduced pricing are made using Intel’s 90nm process technology.

The indicated prices are for direct Intel customers in 1000-unit tray quantities and, unless specified, represent the latest technology versions of the products. Prices may vary for different package types and shipment quantities, and special promotional arrangements may apply, the company notes on its web-sites.

Discussion

Comments currently: 0

You must log in to add comments.

Forgot password? Registration

remember me



Related news

Latest News

Friday, November 20, 2009

10:11 pm | ATI Seeks Its Best to Ensure More Radeon HD 5-Series Supplies – Company. Additional Number of DirectX 11 Graphics Boards is Incoming

11:56 am | Fusion-io’s SSD Setup Reaches 1TB/s Aggregate Bandwidth. Fusion-io Gets Contracts from Government, Creates World’s Fastest SSD Setup

10:06 am | Notebook – the Most Desired Christmas Gift, Says CEA. Notebooks, Players and HDTVs Top Christmas Presents Wish List

9:11 am | Ebay Completes Skype Sell Off. Skype No Longer Belongs to Ebay

Thursday, November 19, 2009

11:38 pm | Sony: PlayStation 3 – Firmware Upgradeable for Stereoscopic 3D. Sony to Upgrade Existing PlayStation 3 Consoles to Stereo 3D Capability

10:31 pm | Elpida Completes Development of 1Gb GDDR5 Chip, Mass Production Scheduled on Q2 2010. Elpida’s First 1Gb GDDR5 Chips to Work at 6GHz

7:32 pm | Galaxy Technology to Release Graphics Card to Rival Asus Mars – Rumour. Galaxy’s New “Masterpeace” is Dual-GPU GeForce GTX 285

2:39 pm | IBM and Infineon Want to Transform Altis into Contract Maker of Semiconductors. Altis Set to Become Independent Foundry Services Provider

12:24 pm | Intel to Explore Hyper Computers in New Research Center. Intel Creates European Exascale Computing Research Center to Study Exaflop Super Computers

9:18 am | Lenovo Readies World’s First AMD-Based ThinkPad Computer. Lenovo ThinkPad X100e: AMD Athlon Neo, DirectX 10, 11.6” HD Display