Search<%BANNER[news_130_l]%>
<%BANNER[mem130]%>
InformationX-bit Labs for mobile users! Do not forget that we are running a special version of X-bit Labs web-site for users of mobile and handheld devices: http://pda.xbitlabs.com. Check out our news and articles from smartphones and PDAs to be always updated on the latest computer and technology news. <%BANNER[left_130x130_2]%>
<%BANNER[right_130x600]%>
|
<%BANNER[top_768x90]%> |
|
<%BANNER[banner_468x60]%>
OtherChartered Semiconductor and IBM to Co-Develop 22nm Bulk Process Technology.Chartered and IBM Extend Technology Development CollaborationCategory: Other by Anton Shilov [ 04/03/2008 | 12:26 PM ]
Chartered Semiconductor Manufacturing, one of the world’s leading c, on Thursday announced the extension of its joint development collaboration with IBM to include 22nm bulk complementary metal oxide semiconductor (CMOS) technology.
“At a time when our customers are just gaining access to the most innovative foundry process in the industry at 32nm, we can now assure them continued customer-centric solutions well into the next decade with 22nm,” said Liang-Choo ‘LC’ Hsia, senior vice president, technology development at Chartered. The extension to 22nm builds on the original multi-year agreement that the two companies first signed in November 2002. Now in its sixth year, the collaborative development program has enabled Chartered to provide foundry access to a leading technology roadmap that leverages invention and innovation for manufacturing solutions, spanning five major generations of advanced process technology, including 90nm, 65nm, 45nm, 32nm, and now 22nm logic processes. As with previous nodes, 22nm development activities will be conducted at IBM’s 300mm semiconductor fabrication facility in East Fishkill, N.Y. Each company will have the ability to implement the jointly developed processes in its own manufacturing facilities. Financial terms of the new agreement were not disclosed. “This news demonstrates that a long-term collaborative model for semiconductor research and development yields significant opportunities to improve application performance and cost. Going forward, it will be material science invention that will improve silicon performance while the collaborative model mitigates the escalating cost of technology and design and improves time to manufacture,” said Gary Patton, vice president, IBM semiconductor research and development center. Related news
<%BANNER[banner_468x30]%>
|
News CategoriesLatest NewsFriday, July 18, 200812:13 pm | Multimedia Sony Has No Plans to Cut PlayStation 3 Pricing – Company. Sony Aims at Profitability, Not Unit Sales with PlayStation 3, Says Chief Financial Officer 6:49 am | Other Intel Denies Accusations of Illegal Business Practices. Intel: CPU Market Is Highly Competitive, AMD’s EC’s Allegations are Unfounded 6:03 am | Storage Micron and Seagate to Lead Solid State Drive Standardization Efforts at JEDEC. JEDEC Announces Dedicated Subcommittee to Set Standards for SSDs Thursday, July 17, 200811:12 pm | Other European Commission Accuses Intel of More Elements of Anti-Competitive Behaviour. European Commission Finds More Examples of Intel’s Illegal Business Practices 8:00 pm | Memory Samsung and Sun Claim that Newly Developed Flash Memory for Servers Will Live Longer than Data Processing Servers. Samsung and Sun Develop Ultra Durable Memory for Server Solid State Drives 2:36 pm | CPU AMD’s Chief Executive Officer Hector Ruiz Steps Down. Dirk Meyer Becomes New Chief Exec of AMD 12:15 pm | CPU Intel: Atom Will Not Substitute Celeron Processors. Intel Denies Possibility to Change Celeron for Atom 10:07 am | Multimedia Sony Cuts Price on PlayStation 3, Axes Backwards Compatibility Too. Sony PlayStation 3 80GB to Cost $399, Backwards Compatibility Lost 5:48 am | Video Microsoft Preps to Unveil DirectX 11 Features in Several Days. ATI, Nvidia, Microsoft to Discuss DirectX 11 Techniques at XNA, Siggraph |
|